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| Product Name: |
Thermally Conductive Stuctural Adhesive
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| Supply Ability: |
1million |
| Related proudcts |
stuctural adhesive, |
| Specifications |
400cc |
| Price Term: |
FOB |
| Port of loading: |
HK |
| Minimum Order |
1000pcs |
| Unit Price: |
1 |
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XK-D12 is a modified epoxy based, two-part liquid dispensable, thermally conductive adhesive with a thermal conductivity of 1.2W/mK. This material features high performance, electrical insulation, structural bonding and seal. XK-D12 provides strong bonding with room temperature cure and can be accelerated with elevated temperature. The high bonding strength eliminates the need of fasteners and maintains structural bond in severe environments. It will flow or fill gaps under low pressure resulting in low stress on component.
It is a trend that thermally conductive structural adhesive will be used in ¡°CTP¡± battery pack? Not only for better heat transfer, but for simplifying module structure to increase energy density and extend service life.
GLPOLY thermally conductive structural adhesive XK-D12 is in trial production in AIWAYS Motor and Lixiang Motor, exhibiting the most excellent performance and strongest bonding strength among competitive products.
As the boom of electric vehicle, internal strucutre of power battery pack is undergoing great change, non-modularization becomes more and more popular, and it¡¯s been applied initiately by CATL co***ny. Then some automakers and battery manufacturers were following suit. What¡¯s the difference between CTP battery pack and traditional module battery pack? Obviously, there is no extra housings, all the cells are bonded by thermally conductive structural adhesive, combining functions of gap filling, heat transfer and structure bond. GLPOLY thermally conductive structural adhesive is such a gap filling material that designs to improve thermal management and range of ¡°CTP¡± battery pack.
What are advantages of GLPOLY thermally conductive structural adhesives?
Firstly, it has 8*** bonding strength while competitive products only provides 5***, even lower, eliminating the need of mechanical fasten, simplifying structure and increasing energy density and service life.
Secondly, thermal conductivity is optional from 1.2 to 13W/mK, improving |
| Company: |
SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD
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| Contact: |
Mr. haijiu chen |
| Address: |
Room 616,619, huafeng xin 'an commercial building, zone 45, bao 'an district, shenzhen |
| Postcode: |
518101 |
| Tel: |
0755-27579310 |
| Fax: |
0755-27579350 |
| E-mail: |
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