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SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD
Company Profile
Business Type:
Manufacturer
Year Established:
2008
Industry Focus:
Products/Services We Offer:
Thermal Gap Filler Thermally Conductive Structural Adhesive Gel Thermal Gap Pad
Main Markets:
China
Other Markets:
North America European
OEM Service:
yes
R&D Staff:
Less than 5 People
Legal Representative / CEO:
kang meiyu
Number of Employees:
11 - 50 People
Annual Turnover:
Below US$1 Million
Certificate:
ISO9001 IATF16949 UL ROHS
Copyright© SHENZHEN GOLDLINK TONGDA ELECTRONICS CO.,LTD All Rights Reserved.
Tel : 0755-27579310 Fax : 0755-27579350
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